Siemon Brings AI-Ready Connectivity to YOTTA 2025
The Siemon Company will showcase its AI-ready connectivity solutions at YOTTA 2025 in Las Vegas from September 8–10. The event will take place at the MGM Grand, where Siemon’s experts will meet attendees at Booth #604. The company will highlight its advanced data center and smart building solutions built for high-performance and scalable infrastructures.
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Driving High-Performance Connectivity
Siemon will present its complete portfolio of copper, fiber, and high-speed connectivity solutions. These offerings meet bandwidth, latency, speed, and density needs, extending from 800 Gig to 1.6T. They are designed to support hyperscale and AI cloud providers as workloads increase.
Live demonstrations will showcase how Siemon’s technology delivers low-power, interoperable connectivity in dense data center environments. Moreover, the solutions address supply chain agility, long-term sustainability, and readiness for future infrastructure demands.
Gary Bernstein, Sr. Director of Global Data Center Solutions at Siemon, emphasized the importance of YOTTA. “YOTTA is a premier platform to connect with leaders shaping the future of digital infrastructure. We are excited to highlight how Siemon’s AI-ready solutions help organizations tackle real-world challenges. From bandwidth and latency to sustainability and supply chain resilience, our portfolio equips customers to scale with confidence,” he said.
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News Source: Prweb.com
