Teradyne and MultiLane recently announced a new joint venture called MultiLane Test Products (MLTP). This partnership focuses on the growing AI data c enter market. It aims to speed up the creation of high-speed data connection tests. The deal should close in the first half of 2026. Teradyne will hold the majority of the new company. MultiLane will keep a minority stake in the venture.
The venture combines Teradyne’s global scale with MultiLane’s technical skills. This move helps both companies serve customers from wafers to data centers. MultiLane will move its test and measurement assets into the venture. However, it will keep its existing interconnect and data center businesses. This collaboration addresses the massive need for reliable high-speed connections.
Strategic Growth for AI Infrastructure
The companies want to deliver agile and comprehensive test solutions. This venture expands the market for Teradyne’s semiconductor and product test groups. It also strengthens MultiLane’s ability to support customers globally. Both firms believe this step is vital for next-generation digital infrastructure.
“Compute architectures are evolving quickly, driven by explosive growth in AI and the need for massive, reliable high‑speed interconnects,” said Greg Smith, President and CEO of Teradyne. “With the creation of MultiLane Test Products, we can expand our abil ity to support Teradyne customers all the way from the wafer level to the data center.”
“With Teradyne, we are building a global platform that combines our technical leadership with their commercial scale and customer reach, enabling us to accelerate innovation and deliver comprehensive test solutions across the entire compute infrastructure from silicon to system,” said Fadi Daou, Founder and CEO of MultiLane.
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News Source: Businesswire.com
